Flex rigid pcb design rules

1. Trace width and spacing: The minimum trace width and spacing should be 4 mils for inner layers and 5 mils for outer layers. The maximum trace width should be 20 mils.
2. Hole size and spacing: The minimum hole size should be 8 mils and the minimum spacing between holes should be 12 mils.
3. Annular ring: The minimum annular ring should be 4 mils for inner layers and 5 mils for outer layers.
4. Pad size: The minimum pad size should be 12 mils for inner layers and 14 mils for outer layers.
5. Solder mask: The minimum solder mask clearance should be 4 mils for inner layers and 5 mils for outer layers.
6. Silkscreen: The minimum silkscreen line width should be 5 mils.
7. Copper thickness: The minimum copper thickness should be 0.5 oz for inner layers and 1 oz for outer layers.
8. Layer stackup: The recommended layer stackup for flex rigid PCBs is 2 to 6 layers.
9. Bend radius: The minimum bend radius for flex circuits should be 10 times the thickness of the thinnest layer.
10. Via placement: Vias should be placed outside the bend area to avoid stress on the via and the surrounding copper.

Iflex is Professinal Flex and rigid-flex PCB manufacturer,
welcome to mail us: contact@iflexpcb.com for your any quesiton about Flex and Rigid-Flex PCB.